industrial 3D model Chip Catching Test Equipment
$150
This is industrial 3D model Chip Catching Test Equipment The chip set uses tray-level material, two groups of uninterrupted feed switching, 3-axis XYZ module equipped with two-way variable gap modular adsorption products, after changing distance, it is put into the test group to detect, automatically divide into OK/NG, the test device takes the chip. Activity summary: 1. Manually place the circuit board and the cavity inside the positioning guide 2. Manually set two groups of Chip Tray; 3. After the photoelectric is detected and loaded in place, the device is ready and the manual button starts the device 4. Lower pressure plate moves to avoid the material discharge position, the suction nozzle changes the distance and moves to the Tray to absorb the material, and after changing the distance, it is pressed down and loaded into the circuit board -selected in each of the two rows; Industry use:Equipment Design software: SolidWorks Version/edit:2018 file format:step(stp) Sldprt Sldasm
This is industrial 3D model Chip Catching Test Equipment The chip set uses tray-level material, two groups of uninterrupted feed switching, 3-axis XYZ module equipped with two-way variable gap modular adsorption products, after changing distance, it is put into the test group to detect, automatically divide into OK/NG, the test device takes the chip. Activity summary: 1. Manually place the circuit board and the cavity inside the positioning guide 2. Manually set two groups of Chip Tray; 3. After the photoelectric is detected and loaded in place, the device is ready and the manual button starts the device 4. Lower pressure plate moves to avoid the material discharge position, the suction nozzle changes the distance and moves to the Tray to absorb the material, and after changing the distance, it is pressed down and loaded into the circuit board -selected in each of the two rows; Industry use:Equipment Design software: SolidWorks Version/edit:2018 file format:step(stp) Sldprt Sldasm
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